Mains Syllabus of isro technical assistant Exam 2024

ISRO Technical Assistant Exam 2024: Mains Syllabus Breakdown

The Indian Space Research Organisation (ISRO) Technical Assistant exam is a highly competitive examination for aspiring technical professionals in the space sector. The Mains exam, conducted after clearing the preliminary exam, is crucial for final selection. This article provides a detailed breakdown of the Mains syllabus for the ISRO Technical Assistant exam in 2024, covering various disciplines.

Mechanical Engineering

1. Engineering Mechanics:

  • Statics: Equilibrium of forces and moments, trusses, beams, frames, friction, centroids, moments of inertia.
  • Dynamics: Kinematics of particles and rigid bodies, work-energy principle, impulse-momentum principle, rotational motion, vibrations.

2. Strength of Materials:

  • Stress and Strain: Stress-strain relationships, elastic constants, Poisson’s ratio, shear stress and strain.
  • Beams and Columns: Bending moment and shear force diagrams, bending stress, shear stress, deflection of beams, buckling of columns.
  • Torsion: Torsional shear stress, angle of twist, power transmission.

3. Fluid Mechanics:

  • Fluid Properties: Density, viscosity, surface tension, compressibility.
  • Fluid Statics: Pressure, buoyancy, Archimedes’ principle.
  • Fluid Dynamics: Continuity equation, Bernoulli’s equation, laminar and turbulent flow, flow through pipes, pumps and turbines.

4. Thermodynamics:

  • Basic Concepts: Temperature, heat, work, internal energy, enthalpy, entropy.
  • Thermodynamic Cycles: Carnot cycle, Rankine cycle, Otto cycle, Diesel cycle.
  • Heat Transfer: Conduction, convection, radiation.

5. Machine Design:

  • Design of Machine Elements: Shafts, bearings, gears, clutches, brakes, springs.
  • Stress Concentration: Fatigue, creep, stress analysis using FEA.
  • Material Selection: Properties of engineering materials, selection criteria.

6. Manufacturing Processes:

  • Metal Cutting: Turning, milling, drilling, grinding.
  • Metal Forming: Rolling, forging, extrusion, drawing.
  • Casting: Sand casting, die casting, investment casting.
  • Welding: Arc welding, gas welding, resistance welding.

7. Engineering Drawing:

  • Orthographic Projections: First angle and third angle projections.
  • Isometric and Perspective Projections: Drawing of machine components.
  • Sectioning and Dimensioning: Standard conventions and practices.

8. Computer Aided Design (CAD):

  • Introduction to CAD Software: AutoCAD, SolidWorks, CATIA.
  • 2D and 3D Modeling: Creating and editing models, dimensioning, annotations.
  • Assembly and Rendering: Creating assemblies, generating realistic images.

Table 1: Mechanical Engineering Syllabus Breakdown

Topic Subtopics
Engineering Mechanics Statics, Dynamics
Strength of Materials Stress and Strain, Beams and Columns, Torsion
Fluid Mechanics Fluid Properties, Fluid Statics, Fluid Dynamics
Thermodynamics Basic Concepts, Thermodynamic Cycles, Heat Transfer
Machine Design Design of Machine Elements, Stress Concentration, Material Selection
Manufacturing Processes Metal Cutting, Metal Forming, Casting, Welding
Engineering Drawing Orthographic Projections, Isometric and Perspective Projections, Sectioning and Dimensioning
Computer Aided Design (CAD) Introduction to CAD Software, 2D and 3D Modeling, Assembly and Rendering

Electrical Engineering

1. Electrical Circuits:

  • Circuit Laws: Kirchhoff’s laws, Ohm’s law, superposition theorem, Thevenin’s theorem, Norton’s theorem.
  • AC Circuits: Phasors, impedance, power factor, resonance.
  • Network Analysis: Mesh and nodal analysis, transient analysis.

2. Electrical Machines:

  • DC Machines: Generators, motors, characteristics, starting and speed control.
  • AC Machines: Transformers, induction motors, synchronous motors, single-phase motors.
  • Special Machines: Stepper motors, servo motors, brushless DC motors.

3. Power Systems:

  • Power Generation: Thermal power plants, hydroelectric power plants, nuclear power plants.
  • Power Transmission and Distribution: Transmission lines, transformers, substations, distribution systems.
  • Power System Protection: Relays, circuit breakers, fuses.

4. Control Systems:

  • Feedback Control Systems: Open-loop and closed-loop systems, transfer functions, stability analysis.
  • Control System Design: PID controllers, state-space analysis.
  • Digital Control Systems: Microcontrollers, digital signal processing.

5. Electronics:

  • Semiconductor Devices: Diodes, transistors, operational amplifiers.
  • Analog Circuits: Amplifiers, oscillators, filters.
  • Digital Circuits: Logic gates, flip-flops, counters, registers.

6. Electrical Measurements:

  • Measurement Instruments: Voltmeters, ammeters, wattmeters, oscilloscopes.
  • Measurement Techniques: AC and DC measurements, power factor measurement, frequency measurement.
  • Data Acquisition Systems: Sensors, transducers, data loggers.

7. Power Electronics:

  • Power Semiconductor Devices: Diodes, thyristors, MOSFETs, IGBTs.
  • DC-DC Converters: Buck, boost, buck-boost converters.
  • AC-DC Converters: Rectifiers, controlled rectifiers.

8. Renewable Energy Sources:

  • Solar Energy: Photovoltaic cells, solar panels, solar inverters.
  • Wind Energy: Wind turbines, wind farms.
  • Other Renewable Sources: Biomass, geothermal, hydropower.

Table 2: Electrical Engineering Syllabus Breakdown

Topic Subtopics
Electrical Circuits Circuit Laws, AC Circuits, Network Analysis
Electrical Machines DC Machines, AC Machines, Special Machines
Power Systems Power Generation, Power Transmission and Distribution, Power System Protection
Control Systems Feedback Control Systems, Control System Design, Digital Control Systems
Electronics Semiconductor Devices, Analog Circuits, Digital Circuits
Electrical Measurements Measurement Instruments, Measurement Techniques, Data Acquisition Systems
Power Electronics Power Semiconductor Devices, DC-DC Converters, AC-DC Converters
Renewable Energy Sources Solar Energy, Wind Energy, Other Renewable Sources

Electronics and Communication Engineering

1. Electronic Devices and Circuits:

  • Semiconductor Devices: Diodes, transistors, operational amplifiers, MOSFETs, JFETs.
  • Analog Circuits: Amplifiers, oscillators, filters, feedback amplifiers.
  • Digital Circuits: Logic gates, flip-flops, counters, registers, memory devices.

2. Signals and Systems:

  • Signal Analysis: Fourier series, Fourier transform, Laplace transform, Z-transform.
  • System Analysis: Linear time-invariant (LTI) systems, convolution, impulse response.
  • Discrete-Time Signals and Systems: Sampling theorem, digital filters.

3. Communication Systems:

  • Analog Communication: Amplitude modulation (AM), frequency modulation (FM), phase modulation (PM).
  • Digital Communication: Pulse amplitude modulation (PAM), pulse code modulation (PCM), digital modulation techniques.
  • Wireless Communication: Cellular networks, Wi-Fi, Bluetooth.

4. Electromagnetic Theory:

  • Electrostatic Fields: Gauss’s law, Coulomb’s law, electric potential.
  • Magnetostatic Fields: Ampere’s law, Biot-Savart’s law, magnetic flux density.
  • Electromagnetic Waves: Maxwell’s equations, wave propagation, transmission lines.

5. Microwave Engineering:

  • Microwave Devices: Waveguides, antennas, microwave transistors, microwave integrated circuits.
  • Microwave Applications: Radar, satellite communication, mobile communication.

6. Digital Signal Processing (DSP):

  • Discrete Fourier Transform (DFT): Fast Fourier transform (FFT), windowing techniques.
  • Digital Filters: FIR filters, IIR filters, filter design techniques.
  • DSP Applications: Audio processing, image processing, speech processing.

7. Control Systems:

  • Feedback Control Systems: Open-loop and closed-loop systems, transfer functions, stability analysis.
  • Control System Design: PID controllers, state-space analysis.
  • Digital Control Systems: Microcontrollers, digital signal processing.

8. Embedded Systems:

  • Microcontrollers: Architecture, programming, interfacing.
  • Real-Time Operating Systems (RTOS): Scheduling, memory management.
  • Embedded System Design: Hardware and software design, system integration.

Table 3: Electronics and Communication Engineering Syllabus Breakdown

Topic Subtopics
Electronic Devices and Circuits Semiconductor Devices, Analog Circuits, Digital Circuits
Signals and Systems Signal Analysis, System Analysis, Discrete-Time Signals and Systems
Communication Systems Analog Communication, Digital Communication, Wireless Communication
Electromagnetic Theory Electrostatic Fields, Magnetostatic Fields, Electromagnetic Waves
Microwave Engineering Microwave Devices, Microwave Applications
Digital Signal Processing (DSP) Discrete Fourier Transform (DFT), Digital Filters, DSP Applications
Control Systems Feedback Control Systems, Control System Design, Digital Control Systems
Embedded Systems Microcontrollers, Real-Time Operating Systems (RTOS), Embedded System Design

Computer Science and Information Technology

1. Programming Fundamentals:

  • Programming Languages: C, C++, Java, Python.
  • Data Structures: Arrays, linked lists, stacks, queues, trees, graphs.
  • Algorithms: Sorting, searching, dynamic programming, graph algorithms.

2. Data Structures and Algorithms:

  • Advanced Data Structures: Heaps, tries, hash tables.
  • Algorithm Design Techniques: Greedy algorithms, divide-and-conquer, dynamic programming.
  • Complexity Analysis: Time complexity, space complexity.

3. Computer Networks:

  • Network Architecture: OSI model, TCP/IP model.
  • Network Protocols: TCP, UDP, HTTP, FTP, DNS.
  • Network Security: Firewalls, intrusion detection systems, cryptography.

4. Operating Systems:

  • Process Management: Process scheduling, memory management, synchronization.
  • File Systems: File organization, file access methods, file system security.
  • Operating System Concepts: Deadlock, concurrency, virtual memory.

5. Database Management Systems (DBMS):

  • Database Concepts: Relational database model, SQL, normalization.
  • Database Design: Entity-relationship diagrams, database schema.
  • Database Administration: Backup and recovery, security, performance tuning.

6. Software Engineering:

  • Software Development Life Cycle (SDLC): Waterfall model, agile methodologies.
  • Software Design: Object-oriented design, design patterns.
  • Software Testing: Unit testing, integration testing, system testing.

7. Web Technologies:

  • HTML, CSS, JavaScript: Web page development, front-end design.
  • Server-Side Programming: PHP, Python, Node.js.
  • Web Frameworks: Django, React, Angular.

8. Cloud Computing:

  • Cloud Computing Concepts: Infrastructure as a service (IaaS), platform as a service (PaaS), software as a service (SaaS).
  • Cloud Services: Amazon Web Services (AWS), Microsoft Azure, Google Cloud Platform (GCP).
  • Cloud Security: Data security, access control, compliance.

9. Artificial Intelligence (AI):

  • Machine Learning: Supervised learning, unsupervised learning, reinforcement learning.
  • Deep Learning: Neural networks, convolutional neural networks, recurrent neural networks.
  • AI Applications: Natural language processing, computer vision, robotics.

10. Cyber Security:

  • Cyber Security Threats: Malware, phishing, ransomware.
  • Cyber Security Measures: Firewalls, intrusion detection systems, antivirus software.
  • Cyber Security Best Practices: Strong passwords, two-factor authentication, regular software updates.

Note: The syllabus for Computer Science and Information Technology may vary depending on the specific specialization.

Conclusion:

The ISRO Technical Assistant Mains exam is a challenging but rewarding opportunity for aspiring technical professionals. By thoroughly understanding the syllabus and preparing effectively, candidates can increase their chances of success. It is crucial to focus on conceptual understanding, problem-solving skills, and practical applications of the subject matter.

ISRO Technical Assistant Mains Exam 2024: Frequently Asked Questions (FAQs)

1. What is the exam pattern for the ISRO Technical Assistant Mains exam?

The Mains exam is typically a written exam consisting of objective-type questions. The duration and number of questions vary depending on the discipline.

2. What are the important topics to focus on for the Mains exam?

Focus on core concepts, problem-solving techniques, and practical applications of the subject matter. Refer to the official syllabus for a detailed breakdown.

3. Are there any negative markings for incorrect answers?

Yes, there is usually a negative marking scheme for incorrect answers. Refer to the official exam instructions for details.

4. What are some good resources for preparing for the Mains exam?

Refer to standard textbooks, online resources, and previous year’s question papers. Join coaching classes or online courses if needed.

5. How can I improve my problem-solving skills for the Mains exam?

Practice a wide range of problems from textbooks, previous year’s papers, and online resources. Analyze your mistakes and learn from them.

6. What are some tips for managing time effectively during the exam?

Allocate time for each section based on the weightage. Attempt easier questions first and then move on to the challenging ones.

7. What are the eligibility criteria for the ISRO Technical Assistant exam?

Refer to the official notification for detailed eligibility criteria, including educational qualifications, age limit, and other requirements.

8. How can I stay motivated during my preparation?

Set realistic goals, create a study plan, and reward yourself for achieving milestones. Stay positive and believe in your abilities.

9. What are the career prospects after clearing the ISRO Technical Assistant exam?

Successful candidates get appointed as Technical Assistants in various ISRO centers, contributing to the development of space technology and research.

10. What are some tips for the interview round?

Prepare well for technical questions related to your discipline. Be confident, articulate, and demonstrate your passion for space technology.