{"id":19863,"date":"2024-04-15T05:45:16","date_gmt":"2024-04-15T05:45:16","guid":{"rendered":"https:\/\/exam.pscnotes.com\/mcq\/?p=19863"},"modified":"2024-04-15T05:45:16","modified_gmt":"2024-04-15T05:45:16","slug":"chemical-mechanical-polishing-is-used-to-a-remove-silicon-oxide-b-remove-silicon-nitride-and-pad-oxide-c-remove-polysilicon-gate-layer-d-reduce-the-size-of-the-layout","status":"publish","type":"post","link":"https:\/\/exam.pscnotes.com\/mcq\/chemical-mechanical-polishing-is-used-to-a-remove-silicon-oxide-b-remove-silicon-nitride-and-pad-oxide-c-remove-polysilicon-gate-layer-d-reduce-the-size-of-the-layout\/","title":{"rendered":"Chemical Mechanical Polishing is used to . . . . . . . . A. Remove silicon oxide B. Remove silicon nitride and pad oxide C. Remove polysilicon gate layer D. Reduce the size of the layout"},"content":{"rendered":"<p>\r\n    <!-- Check if it's an AMP page -->\r\n            <!-- Non-AMP version -->\r\n        <div class=\"mcq-container\" data-quiz-id=\"quizState_6a9836b954545\">\r\n                                            <div class=\"option\" data-option-key=\"option1\" data-is-correct=\"true\">\r\n                    Remove silicon oxide                <\/div>\r\n                                            <div class=\"option\" data-option-key=\"option2\" data-is-correct=\"false\">\r\n                    Remove silicon nitride and pad oxide                <\/div>\r\n                                            <div class=\"option\" data-option-key=\"option3\" data-is-correct=\"false\">\r\n                    Remove polysilicon gate layer                <\/div>\r\n                                            <div class=\"option\" data-option-key=\"option4\" data-is-correct=\"false\">\r\n                    Reduce the size of the layout                <\/div>\r\n                            \r\n            <!-- Feedback messages for non-AMP -->\r\n            <div class=\"feedback\" data-feedback=\"wrong\">Answer is Right!<\/div>\r\n            <div class=\"feedback\" data-feedback=\"right\">Answer is Wrong!<\/div>\r\n        <\/div>\r\n\r\n        <script>\r\n        document.addEventListener('DOMContentLoaded', function () {\r\n            var containers = document.querySelectorAll('.mcq-container');\r\n\r\n            containers.forEach(function(container) {\r\n                var options = container.querySelectorAll('.option');\r\n                var feedbackSelect = container.querySelector('[data-feedback=\"select\"]');\r\n                var feedbackWrong = container.querySelector('[data-feedback=\"wrong\"]');\r\n                var feedbackRight = container.querySelector('[data-feedback=\"right\"]');\r\n\r\n                options.forEach(function(option) {\r\n                    option.addEventListener('click', function() {\r\n                        var selectedOption = option.getAttribute('data-option-key');\r\n                        var isCorrect = option.getAttribute('data-is-correct') === 'true';\r\n\r\n                        \/\/ Remove previous selections\r\n                        options.forEach(function(opt) {\r\n                            opt.classList.remove('correct', 'incorrect');\r\n                        });\r\n\r\n                        \/\/ Add the correct\/incorrect class\r\n                        if (isCorrect) {\r\n                            option.classList.add('correct');\r\n                            feedbackRight.hidden = false;\r\n                            feedbackWrong.hidden = true;\r\n                        } else {\r\n                            option.classList.add('incorrect');\r\n                            feedbackRight.hidden = true;\r\n                            feedbackWrong.hidden = false;\r\n                        }\r\n\r\n                        \/\/ Hide select feedback\r\n                        feedbackSelect.hidden = true;\r\n                    });\r\n                });\r\n            });\r\n        });\r\n        <\/script>\r\n    \r\n    <!--more--><\/p>\n<p>The correct answer is: A. Remove silicon oxide.<\/p>\n<p>Chemical mechanical polishing (CMP) is a process used <div class=\"youtube-subscribe-container\">\r\n        <a href=\"https:\/\/www.youtube.com\/channel\/UCNHT8lW-JmLC68rjBfZhdkg?sub_confirmation=1\" target=\"_blank\" class=\"youtube-subscribe-button\">\r\n            <span class=\"youtube-icon\">\r\n                <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" viewBox=\"0 0 576 512\">\r\n                    <path d=\"M549.7 124.1c-6.3-23.7-24.8-42.3-48.3-48.6C458.8 64 288 64 288 64S117.2 64 74.6 75.5c-23.5 6.3-42 24.9-48.3 48.6-11.4 42.9-11.4 132.3-11.4 132.3s0 89.4 11.4 132.3c6.3 23.7 24.8 41.5 48.3 47.8C117.2 448 288 448 288 448s170.8 0 213.4-11.5c23.5-6.3 42-24.2 48.3-47.8 11.4-42.9 11.4-132.3 11.4-132.3s0-89.4-11.4-132.3zm-317.5 213.5V175.2l142.7 81.2-142.7 81.2z\"\/>\r\n                <\/svg>\r\n            <\/span>\r\n            Subscribe on YouTube\r\n        <\/a>\r\n    <\/div> to planarize wafer surfaces. It is a combination of chemical and mechanical actions that remove material from the wafer surface. The chemical action is typically a strong acid or base, while the mechanical action is typically a rotating abrasive pad.<\/p>\n<p>CMP is used in a variety of semiconductor manufacturing processes, including the fabrication of integrated circuits (ICs). It is used to remove the silicon oxide layer that is used to protect the IC&#8217;s active devices. CMP is also used to remove the silicon nitride and pad oxide layers that are used to protect the IC&#8217;s metal interconnects.<\/p>\n<p>CMP is a very precise process that can be used to remove very thin layers of material. It is also a very versatile process that can be used to remove <div class=\"telegram-channel-container\">\r\n        <a href=\"https:\/\/t.me\/pscnotes2025\" target=\"_blank\" class=\"telegram-channel-button\">\r\n            <span class=\"telegram-icon\">\r\n                <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" viewBox=\"0 0 496 512\">\r\n                    <path fill=\"white\" d=\"M248,8C111,8,0,119,0,256s111,248,248,248s248-111,248-248S385,8,248,8z M362,177L320,367c-3,14-10,18-20,14l-56-41l-27,26 c-3,3-5,5-10,5l4-63L323,196c5-5-1-7-8-3l-98,62l-42-13c-9-3-10-9,2-14l162-63C351,160,365,164,362,177z\"\/>\r\n                <\/svg>\r\n            <\/span>\r\n            Join Our Telegram Channel\r\n        <\/a>\r\n    <\/div> a variety of materials, including silicon oxide, silicon nitride, and polysilicon.<\/p>\n<p>Here is a brief explanation of each option:<\/p>\n<ul>\n<li>Option A: Remove silicon oxide. This is the correct answer. CMP is used to remove the silicon oxide layer that is used to protect the IC&#8217;s active devices.<\/li>\n<li>Option B: Remove silicon nitride and pad oxide. This is not the correct answer. CMP is used to remove the silicon nitride and pad oxide layers that are used to protect the IC&#8217;s metal interconnects.<\/li>\n<li>Option C: Remove polysilicon gate layer. This is not the correct answer. CMP is not typically used to remove the polysilicon gate layer.<\/li>\n<li>Option D: Reduce the size of the layout. This is not the correct answer. CMP is not used to reduce the size of the layout.<\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"<p>Join Our Telegram Channel Subscribe on YouTube<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[687],"tags":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v22.2 (Yoast SEO v23.3) - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Chemical Mechanical Polishing is used to . . . . . . . . A. Remove silicon oxide B. Remove silicon nitride and pad oxide C. Remove polysilicon gate layer D. 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