[amp_mcq option1=”Increases” option2=”Decreases” option3=”Remains the same” option4=”Cannot be determined” correct=”option1″]<\/p>\n
The correct answer is: A. Increases<\/p>\n
As die size shrinks, the complexity of making the photomasks increases. This is because the smaller the die size, the more precise the photomask must be in order to create the desired pattern on the wafer. Additionally, as die size shrinks, the number of layers in the photomask increases, which further complicates the manufacturing process.<\/p>\n
Option B is incorrect because the complexity of making photomasks actually increases as die size shrinks. Option C is incorrect because the complexity of making photomasks does not remain the same as die size shrinks. Option D is incorrect because it is possible to determine the effect of die size on the complexity of making photomasks.<\/p>\n","protected":false},"excerpt":{"rendered":"
[amp_mcq option1=”Increases” option2=”Decreases” option3=”Remains the same” option4=”Cannot be determined” correct=”option1″]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[687],"tags":[],"class_list":["post-19744","post","type-post","status-publish","format-standard","hentry","category-vlsi-design-and-testing","no-featured-image-padding"],"yoast_head":"\n