Interconnection pattern is made on . . . . . . . . A. Polysilicon layer B. Silicon-di-oxide layer C. Metal layer D. Diffusion layer

[amp_mcq option1=”Polysilicon layer” option2=”Silicon-di-oxide layer” option3=”Metal layer” option4=”Diffusion layer” correct=”option3″]

The correct answer is C. Metal layer.

A metal layer is a thin layer of metal that is deposited on top of a semiconductor wafer. It is used to create the interconnection pattern that connects the different components of an integrated circuit.

The other options are incorrect because:

  • A polysilicon layer is a thin layer of polycrystalline silicon that is used to create the gates of MOSFETs.
  • A silicon-dioxide layer is a thin layer of silicon dioxide that is used to insulate the different components of an integrated circuit.
  • A diffusion layer is a thin layer of semiconductor material that is diffused into a semiconductor wafer to create regions with different electrical properties.
Exit mobile version