Interconnection pattern is made on . . . . . . . . A. Polysilicon layer B. Silicon-di-oxide layer C. Metal layer D. Diffusion layer

The correct answer is C. Metal layer.

A metal layer is a thin layer of metal that is deposited on top of a semiconductor wafer. It is used to create the interconnection pattern that connects the different components of an integrated circuit.

The other options are incorrect because:

• A polysilicon layer is a thin layer of polycrystalline silicon that is used to create the gates of MOSFETs.
• A silicon-dioxide layer is a thin layer of silicon dioxide that is used to insulate the different components of an
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  integrated circuit.
• A diffusion layer is a thin layer of semiconductor material that is diffused into a semiconductor wafer to create regions with different electrical properties.