Heavily doped polysilicon is deposited using . . . . . . . . A. Chemical vapour decomposition B. Chemical vapour deposition C. Chemical deposition D. Dry deposition

[amp_mcq option1=”Chemical vapour decomposition” option2=”Chemical vapour deposition” option3=”Chemical deposition” option4=”Dry deposition” correct=”option2″]

The correct answer is: B. Chemical vapour deposition

Chemical vapor deposition (CVD) is a chemical process used to produce thin films and coatings. The process involves the chemical reaction of vaporized chemical precursors at the surface of a substrate, where the desired film or coating is deposited.

CVD is a versatile process that can be used to deposit a wide variety of materials, including metals, semiconductors, and insulators. It is also a relatively low-cost process, and it can be used to deposit films with a high degree of uniformity and thickness control.

CVD is used in a variety of industries, including semiconductor manufacturing, microelectronics, optics, and thin film deposition.

The other options are incorrect because:

  • A. Chemical vapour decomposition is a different process that involves the decomposition of a chemical compound into its constituent elements.
  • C. Chemical deposition is a general term that can refer to any process that involves the deposition of a material from a gas phase.
  • D. Dry deposition is a process that involves the deposition of particles from the atmosphere onto a surface.
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