The correct answer is: A. Placing an IC in a non-conductive plastic bag
ESD stands for Electrostatic Discharge. It is a sudden flow of electricity between two objects that have different electric charges. ESD can damage electronic components, such as integrated circuits (ICs).
Placing an IC in a non-conductive plastic bag can cause ESD damage because the bag will not conduct electricity away from the IC. This can cause the IC to build up a static charge, which can then discharge when the IC comes into contact with another object. This discharge can damage the IC.
The other options are not as likely to cause ESD damage. Placing an IC on a grounded mat will help to dissipate any static charge that may build up on the IC. Repeated sags in current supplied from outlets can cause voltage fluctuations, but these fluctuations are not likely to be high enough to damage an IC. Touching metal on the chassis will ground the user and help to prevent ESD damage.
In conclusion, the correct answer is: A. Placing an IC in a non-conductive plastic bag.