ESD damage can be caused by: A. Placing an IC in a non-conductive plastic bag B. Placing an IC on a grounded mat C. Repeated sags in current supplied from outlets D. Touching metal on the chasis E. None of the above

Placing an IC in a non-conductive plastic bag
Placing an IC on a grounded mat
Repeated sags in current supplied from outlets
Touching metal on the chasis E. None of the above

The correct answer is: A. Placing an IC in a non-conductive plastic bag.

ESD stands for Electrostatic Discharge. It is a sudden flow of electricity between two objects at different electrical potentials. ESD can damage electronic components, such as integrated circuits (ICs).

Placing an IC in a non-conductive plastic bag can cause ESD damage because the bag will not conduct electricity away from the IC. This can cause a build-up of static electricity on the IC, which can then discharge when the IC comes into contact with another object.

The other options are not correct because they do not create a situation where static electricity can build up on an IC.

  • Placing an IC on a grounded mat will help to dissipate static electricity away from the IC.
  • Repeated sags in current supplied from outlets will not cause ESD damage because they do not create a difference in electrical potential between the IC and another object.
  • Touching metal on the chassis will help to ground the IC and prevent ESD damage.

Therefore, the correct answer is: A. Placing an IC in a non-conductive plastic bag.

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