Placing an IC in a non-conductive plastic bag
Placing an IC on a grounded mat
Repeated sags in current supplied from outlets
Touching metal on the chasis E. None of the above
Answer is Right!
Answer is Wrong!
The correct answer is: A. Placing an IC in a non-conductive plastic bag.
ESD stands for Electrostatic Discharge. It is a sudden flow of electricity between two objects at different electrical potentials. ESD can damage electronic components, such as integrated circuits (ICs).
Placing an IC in a non-conductive plastic bag can cause ESD damage because the bag will not conduct electricity away from the IC. This can cause a build-up of static electricity on the IC, which can then discharge when the IC comes into contact with another object.
The other options are not correct because they do not create a situation where static electricity can build up on an IC.
- Placing an IC on a grounded mat will help to dissipate static electricity away from the IC.
- Repeated sags in current supplied from outlets will not cause ESD damage because they do not create a difference in electrical potential between the IC and another object.
- Touching metal on the chassis will help to ground the IC and prevent ESD damage.
Therefore, the correct answer is: A. Placing an IC in a non-conductive plastic bag.